Title:
APPARATUS FOR PRECIPITATION/SEPARATION OF EXCESS COPPER IN LEAD-FREE SOLDER
Document Type and Number:
WIPO Patent Application WO/2008/072330
Kind Code:
A1
Abstract:
An apparatus for precipitating/separating excess copper which has dissolved
in a lead-free solder comprising tin as the main ingredient. With the apparatus,
the tin is safely and efficiently recovered. The apparatus (1) enables copper
which has dissolved in a lead-free solder comprising tin as the main ingredient
to precipitate as an intermetallic compound to separate the copper. It has a constitution
comprising: a precipitation tank (2) in which a lead-free solder containing
copper dissolving therein is kept in a molten state and an intermetallic compound
among a metal added externally, the copper contained in the molten solder, and
the tin contained in the molten solder is precipitated while maintaining the
molten state; a granulation tank (4) which has perforated plates (31), (32),
and (33) and in which the molten lead-free solder is passed through the perforated
plates to thereby bond particles of the intermetallic compound to one another
and increase the particle diameter thereof; and a separation tank (5) in which
the enlarged intermetallic compound particles are sedimented in the molten
lead-free solder and separated.
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Inventors:
NISHIMURA TETSURO (JP)
Application Number:
PCT/JP2006/324949
Publication Date:
June 19, 2008
Filing Date:
December 14, 2006
Export Citation:
Assignee:
NIHON SUPERIOR SHA CO LTD (JP)
NISHIMURA TETSURO (JP)
NISHIMURA TETSURO (JP)
International Classes:
B23K3/08; C22B25/06; C22B7/00; C22B9/10
Foreign References:
| JPH01168826A | 1989-07-04 | |||
| US5388756A | 1995-02-14 | |||
| JPH05295461A | 1993-11-09 | |||
| JP2006206951A | 2006-08-10 | |||
| EP1908853A1 | 2008-04-09 |
Other References:
See also references of EP 2096182A4
Attorney, Agent or Firm:
HAMADA, Toshiaki (MS Building 2nd floor 8-8Bakuro-machi 1-chome,Chuo-ku, Osaka-shi, Osaka 59, JP)
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