APPARATUS AND METHOD FOR CLEANING SURFACES OF SEMICONDUCTOR WAFERS USING OZONE

Title:

APPARATUS AND METHOD FOR CLEANING SURFACES OF SEMICONDUCTOR WAFERS USING OZONE

Document Type and Number:

WIPO Patent Application WO2004040370

Kind Code:

A3

Abstract:

An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.

More Like This:

WO/2021/009305	HOT FLUID CLEANING DEVICE, CONNECTION ELEMENT, COMBINATION AND METHOD
JPS6033699	[Title of the device] Lid device

Inventors:

YONG BAE KIM
IN KWON JEONG
JUNGYUP KIM

Application Number:

PCT/US2003/034376

Publication Date:

December 29, 2004

Filing Date:

October 29, 2003

Export Citation:

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Assignee:

NOVO RES INC (US)

International Classes:

B08B3/00; B08B3/02; B08B7/04; (IPC1-7): B08B3/02; B08B3/12; B08B6/00; H01L21/304

Foreign References:

US5961377A	1999-10-05
US6290777B1	2001-09-18
US20020108641A1	2002-08-15

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