Title:
AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/084682
Kind Code:
A1
Abstract:
Provided is an aqueous dispersion for chemical mechanical polishing, which can achieve high speed polishing of a group III-V metal film or group IV metal film and can reduce the number of scratches on the group III-V metal film or group IV metal film and suppress generation of reducing gases in a step of polishing a surface-to-be-polished having a group III-V material or group IV material. Also provided is a chemical mechanical polishing method that uses this aqueous dispersion for chemical mechanical polishing. This aqueous dispersion for chemical mechanical polishing is used to polish a surface-to-be-polished having a group III-V material or group IV material, and is characterized by containing (A) moniliform colloidal silica obtained by joining spherical colloidal silica particles that are primary particles.
Inventors:
KAWAMOTO TATSUYOSHI (JP)
YAMANAKA TATSUYA (JP)
OOISHI YOUHEI (JP)
YAMANAKA TATSUYA (JP)
OOISHI YOUHEI (JP)
Application Number:
PCT/JP2015/082462
Publication Date:
June 02, 2016
Filing Date:
November 18, 2015
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Foreign References:
| JP2001011433A | 2001-01-16 | |||
| JP2013115152A | 2013-06-10 | |||
| JPH10329011A | 1998-12-15 | |||
| JP2007103463A | 2007-04-19 | |||
| JP2011129752A | 2011-06-30 |
Attorney, Agent or Firm:
OFUCHI, Michie et al. (JP)
Obuchi Yoshikazu glory (JP)
Obuchi Yoshikazu glory (JP)
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