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Patent Searching and Data


Title:
AQUEOUS RESIN COMPOSITION, METHOD FOR PRODUCING COATING FILM, AQUEOUS RESIN COMPOSITION SET
Document Type and Number:
WIPO Patent Application WO/2023/119850
Kind Code:
A1
Abstract:
The present invention provides an aqueous resin composition comprising an aqueous resin emulsion (α), a curing agent (β), a curing accelerator (γ), and a silane coupling agent (δ), in which: (α) contains a copolymer (X), a polyepoxy compound (Y) having two or more epoxy groups per molecule, and an aqueous medium (Z); (X) contains a structural unit derived from a (meth)acrylic acid ester (A) and a structural unit derived from an ethylenically unsaturated carboxylic acid (B); the structural unit derived from (A) contains a structural unit derived from a (meth)acrylic acid ester (A1) in which there are no more than two carbon atoms in the alcohol-derived moiety; (β) contains a polyamine (F) having an active hydrogen that is reactive with epoxy groups; and (γ) includes a tertiary amine devoid of an active hydrogen that is reactive with epoxy groups.

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Inventors:
KUZUTANI TAKUYA (JP)
MURATA NAOKI (JP)
Application Number:
PCT/JP2022/039715
Publication Date:
June 29, 2023
Filing Date:
October 25, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C08G59/50; B05D7/24; C08K5/54; C08L33/06; C08L63/00; C09D5/02; C09D5/08; C09D133/06; C09D163/00; C08F283/10
Foreign References:
CN1814663A2006-08-09
CN108912281A2018-11-30
CN112724789A2021-04-30
JPH03182519A1991-08-08
JPH1025308A1998-01-27
JP2002194035A2002-07-10
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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