Title:
FLOCKED SPRING
Document Type and Number:
WIPO Patent Application WO/2023/119849
Kind Code:
A1
Abstract:
A flocked spring (30) according to the present invention comprises: a spring main body (31); a coating layer (32) which is arranged on the surface of the spring main body (31); an adhesive layer (33) which is arranged on the surface of the coating layer (32); and a flocking layer (34) which is composed of flocking fillers that are affixed to the adhesive layer (33). The adhesive layer (33) is formed of an adhesive composition that contains an adhesive and a thixotropy-imparting agent. With respect to this flocked spring (30), the thickness of the adhesive layer (33) can be increased, and the number of flocking fillers that constitute the flocking layer (34) can be increased. Consequently, a flocked spring according to the present invention causes less damage on a counterpart member.
More Like This:
Inventors:
KUNITA YASUHIKO (JP)
Application Number:
PCT/JP2022/039705
Publication Date:
June 29, 2023
Filing Date:
October 25, 2022
Export Citation:
Assignee:
CHUO HATSUJO KK (JP)
International Classes:
B32B27/20; C09J11/04; C09J201/00; F16F1/12
Foreign References:
| JP2021510358A | 2021-04-22 | |||
| JP2009024271A | 2009-02-05 | |||
| JPS6424875A | 1989-01-26 | |||
| JPS63209929A | 1988-08-31 | |||
| JP2019182931A | 2019-10-24 | |||
| JP2015535862A | 2015-12-17 | |||
| JP2008530294A | 2008-08-07 |
Attorney, Agent or Firm:
HIGASHIGUCHI Michiaki et al. (JP)
Download PDF: