ARRAY CAMERA MODULE HAVING HEIGHT DIFFERENCE, CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

Title:

ARRAY CAMERA MODULE HAVING HEIGHT DIFFERENCE, CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2018/113709

Kind Code:

A1

Abstract:

An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portions at least partially extend towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.

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Inventors:

WANG MINGZHU (CN)
TANAKA TAKEHIKO (JP)
CHEN ZHENYU (CN)
GUO NAN (CN)
ZHAO BOJIE (CN)
MEI ZHEWEN (CN)

Application Number:

PCT/CN2017/117579

Publication Date:

June 28, 2018

Filing Date:

December 20, 2017

Export Citation:

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Assignee:

NINGBO SUNNY OPOTECH CO LTD (CN)

International Classes:

H04N5/232

Foreign References:

CN104660909A	2015-05-27
CN105791648A	2016-07-20
CN105893578A	2016-08-24
JP2008172523A	2008-07-24

Other References: