Title:
ARRAY SUBSTRATE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/226020
Kind Code:
A1
Abstract:
Embodiments of the present invention provide an array substrate and an electronic device. The array substrate comprises: a base substrate; a first conductive layer, located on the base substrate, the first conductive layer comprising multiple pads, each pad comprising a first metal layer, the material of the first metal layer comprising Cu, the content of Cu being greater than or equal to 99%, and the thickness of the first metal layer being greater than 2μm; and an electronic component, located on the side of the first conductive layer farthest from the base substrate, the electronic component comprising an electronic component body and multiple pins located on the side of the electronic component body facing the base substrate, and the pins being connected to the pads.
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Inventors:
TANG HAI (CN)
KANG PING (CN)
LV CHAOREN (CN)
WANG KANGLI (CN)
GAO LIANG (CN)
KANG PING (CN)
LV CHAOREN (CN)
WANG KANGLI (CN)
GAO LIANG (CN)
Application Number:
PCT/CN2022/095708
Publication Date:
November 30, 2023
Filing Date:
May 27, 2022
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI BOE RUISHENG TECH CO LTD (CN)
HEFEI BOE RUISHENG TECH CO LTD (CN)
International Classes:
G02F1/133; H01L33/62
Domestic Patent References:
| WO2022048538A1 | 2022-03-10 |
Foreign References:
| CN114509884A | 2022-05-17 | |||
| CN103137630A | 2013-06-05 | |||
| US6624864B1 | 2003-09-23 | |||
| US20100258335A1 | 2010-10-14 | |||
| JP2003098975A | 2003-04-04 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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