ULTRASONIC TRANSDUCER AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2023/226021

A1

Embodiments of the present disclosure provide an ultrasonic transducer and a manufacturing method therefor, and an electronic device. The ultrasonic transducer comprises: an array substrate provided with a groove, a bottom electrode, and an insulating layer, wherein the orthographic projection of the groove on the array substrate is located within the range of the orthographic projection of the bottom electrode on the array substrate, and the insulating layer covers the bottom electrode; and a counter substrate, wherein the counter substrate and the array substrate are provided opposite to each other and are attached to each other, the counter substrate and the array substrate form a cavity at the groove, the counter substrate is provided with a top electrode and a diaphragm layer which are provided in a stacked manner, and the orthographic projection of the top electrode on the array substrate is located within the range of the orthographic projection of the bottom electrode on the array substrate.

HAN YANLING (CN)
LIU WENQU (CN)
YAO QI (CN)
WANG LEI (CN)
HUANG HUA (CN)
LI ZHUO (CN)
CAO YONGGANG (CN)
GOU YUE (CN)
JI YAQIAN (CN)
LI QIANYAN (CN)
WANG YINGZI (CN)

PCT/CN2022/095709

November 30, 2023

May 27, 2022

Click for automatic bibliography generation  

BOE TECHNOLOGY GROUP CO LTD (CN)

H04R31/00; H04R7/10

CN110057907A	2019-07-26
CN105578368A	2016-05-11
CN110773408A	2020-02-11
CN105540528A	2016-05-04
US20080259725A1	2008-10-23

TDIP & PARTNERS (CN)

View/Download PDF      PDF Help

Previous Patent: ARRAY SUBSTRATE AND ELECTRONIC DEVICE

Next Patent: METHODS AND APPARATUSES OF A POWER SAVING MECHANISM FOR XR TRAFFIC