Title:
ATTRACTIVE ADHESION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/145839
Kind Code:
A1
Abstract:
This attractive adhesion substrate comprises an insulating base, a conductive layer, and a protruding section. The base has a first surface that retains an item under processing, and a second surface that is located on the opposite side from the first surface. The conductive layer is located in the interior of the base, and extends along the first surface. The protruding section is located in the interior of the base, and protrudes from the conductive layer toward the second surface side. The protruding section has a first end surface that is in contact with the conductive section, and a second end surface that is located on the second surface side. A first distance between the first end surface and the second end surface is greater than 1/2 times the thickness of the conductive layer.
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Inventors:
KAWANABE YASUNORI (JP)
ITO MASAKI (JP)
ITO MASAKI (JP)
Application Number:
PCT/JP2023/002509
Publication Date:
August 03, 2023
Filing Date:
January 26, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L21/683; H02N13/00
Foreign References:
| JP2013084938A | 2013-05-09 | |||
| JP2004259805A | 2004-09-16 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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