AUTOMATIC OPERATION METHOD AND SYSTEM FOR LASER PLATFORM

WIPO Patent Application WO/2021/259120

A1

The present application provides an automatic operation method and system for a laser platform. The method comprises: (a) determining, according to feature information, whether an operation on a wafer on a laser platform has been completed, and if so, skipping the laser platform and performing a subsequent process, and if not, performing step (b); (b) performing a process on the wafer on the laser platform, and the laser platform generating record information, in which the record information is related to operation information of the wafer on the laser platform; and (c) acquiring the record information, and generating feature information according to the record information, in which the feature information serves as a basis for the determination of step (a). The present application has the following advantages: feature information is generated according to local record information of a laser platform, and then it is determined, by means of a feature chip, whether laser operation on a wafer on the laser platform has been completed, thereby preventing a wafer having undergone laser operation from undergoing laser processing again, improving a wafer yield, and reducing loss.

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LU YUBIN (CN)

PCT/CN2021/100515

December 30, 2021

June 17, 2021

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CHANGXIN MEMORY TECH INC (CN)

H01L21/67

CN108356412A	2018-08-03
CN1541800A	2004-11-03
JP2021027071A	2021-02-22
JP2021027119A	2021-02-22
CN106298125A	2017-01-04
CN105397281A	2016-03-16
JP2016112579A	2016-06-23

SHANGHAI WINSUN INTELLECTUAL PROPERTY AGENCY (CN)

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