Title:
AUTOMATIC WIRING DEVICE, WIRING SUBSTRATE MANUFACTURING METHOD, AND SUBSTRATE FOR AUTOMATIC WIRING
Document Type and Number:
WIPO Patent Application WO/2022/215308
Kind Code:
A1
Abstract:
An automatic wiring device (1) comprises a wire assembling machine (3) and a wire processing machine (2). The wire assembling machine (3) includes: an assembly hand (20) that can incorporate a wire (5) into a product (7); and an actuator (28) that can cause the assembly hand (20) to move. The assembly hand (20) includes: a first gripper (22) that can grip the wire (5); a second gripper (23) that can grip the wire (5); a first shaft (24) that can make contact with the wire (5); and a second shaft (25) that is capable of moving or extending toward the wire (5) and that can make contact with the wire (5). The wire processing machine (2) includes a cutter (16) that can cut the wire (5).
Inventors:
MAEDA TAKEHIRO (JP)
Application Number:
PCT/JP2022/000026
Publication Date:
October 13, 2022
Filing Date:
January 04, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B21F11/00; B21F23/00; H05K13/04; H05K13/06
Domestic Patent References:
| WO2018193754A1 | 2018-10-25 |
Foreign References:
| JPH0715198A | 1995-01-17 | |||
| JPH09211942A | 1997-08-15 | |||
| JPS63138676A | 1988-06-10 | |||
| JP2012099535A | 2012-05-24 | |||
| JPS56129400A | 1981-10-09 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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