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Patent Searching and Data


Title:
BACKLIGHT MODULE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/042280
Kind Code:
A1
Abstract:
A backlight module and a preparation method therefor. The backlight module comprises a flexible circuit substrate. The flexible circuit substrate comprises a flexible substrate (11), a white oil layer (13) and an LED chip (23). The flexible substrate (11) is provided thereon with a first pad (20) and a second pad (21). The white oil layer (13) is disposed on the flexible substrate (11) and forms an open window region (22) after patterning. Two ends of the LED chip (23) are respectively electrically connected to a positive electrode of the first pad (20) and a negative electrode of the second pad (21) by means of the open window region (22). The open window region (22) at least exposes the positive electrode and the negative electrode.

Inventors:
YANG YONG (CN)
Application Number:
PCT/CN2018/109426
Publication Date:
March 05, 2020
Filing Date:
October 09, 2018
Export Citation:
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Assignee:
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L27/12; H01L21/77
Foreign References:
CN104075194A2014-10-01
CN103703579A2014-04-02
CN101097345A2008-01-02
CN102506347A2012-06-20
CN107910322A2018-04-13
CN206833117U2018-01-02
CN104851395A2015-08-19
CN203675421U2014-06-25
TWI333571B2010-11-21
JP2007067116A2007-03-15
Attorney, Agent or Firm:
ESSEN PATENT&TRADEMARK AGENCY (CN)
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