Title:
BASE FILM FOR FPCB AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/099415
Kind Code:
A1
Abstract:
The present invention relates to a base film for an FPCB and a method for manufacturing the same, the base film for an FPCB, as a heat resistant plastic film, comprising: a polyimide film used as a base material; a copper foil film attached to the upper and lower portions of the polyimide film and patterned by etching to form a wiring circuit; and a silicone adhesive for bonding the polyimide film and the copper foil film, wherein the silicone adhesive comprises 35 to 45 wt% of liquid silicone, 5 to 15 wt% of aluminum powder, and 50 wt% of organic solvent. According to the present invention, a copper foil can easily be attached to a polyimide film having excellent heat resistance by a silicone adhesive having excellent heat resistance and durability, instead of plating the copper foil on the polymide film, thereby forming a base film for an FPCB having economically excellent heat resistance and durability, and improving production efficiency.
Inventors:
KIM YU SIN (KR)
Application Number:
PCT/KR2016/014014
Publication Date:
June 15, 2017
Filing Date:
December 01, 2016
Export Citation:
Assignee:
TRUE DIGITAL LEADER CO LTD (KR)
International Classes:
B32B15/08; B32B7/12; B32B15/20; B32B27/28; B32B37/12; C09J183/04; H05K1/03
Foreign References:
| JP2013184298A | 2013-09-19 | |||
| JP2014130739A | 2014-07-10 | |||
| KR20140107116A | 2014-09-04 | |||
| JPH10126035A | 1998-05-15 | |||
| JPH1149958A | 1999-02-23 |
Attorney, Agent or Firm:
NAMCHON INTERNATIONAL PATENT AND LAW FIRM (KR)
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