Title:
BASE MATERIAL WHICH IS USED FOR ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFER HAVING PROJECTED PART
Document Type and Number:
WIPO Patent Application WO/2023/068088
Kind Code:
A1
Abstract:
The present invention provides a base material for semiconductor wafer processing, the base material being capable of enhancing adhesion to a stage in a semiconductor wafer processing step. The present invention provides a base material which is used for an adhesive sheet for processing a semiconductor wafer having a projected part, wherein the thermal shrinkages of the base material in the machine direction (MD) and in the transverse direction (TD) after heating at 130°C for 10 minutes are both 0% or more.
Inventors:
HASUMI MIZUKI (JP)
MOTOIKE SHINGO (JP)
IIZUKA KAZUKI (JP)
NAKAMURA MASASHI (JP)
MOTOIKE SHINGO (JP)
IIZUKA KAZUKI (JP)
NAKAMURA MASASHI (JP)
Application Number:
PCT/JP2022/037680
Publication Date:
April 27, 2023
Filing Date:
October 07, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B27/00; H01L21/304; C09J7/20; C09J7/29; C09J7/38; C09J201/00; H01L21/301; H01L21/683
Domestic Patent References:
| WO2013084952A1 | 2013-06-13 | |||
| WO2018181240A1 | 2018-10-04 | |||
| WO2020071159A1 | 2020-04-09 | |||
| WO2019208378A1 | 2019-10-31 |
Foreign References:
| JP2003138228A | 2003-05-14 | |||
| JP2011054940A | 2011-03-17 | |||
| JP2011018669A | 2011-01-27 | |||
| JP2000216123A | 2000-08-04 | |||
| JP2013023665A | 2013-02-04 | |||
| JP2013120841A | 2013-06-17 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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