Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BASE MATERIAL WHICH IS USED FOR ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFER HAVING PROJECTED PART
Document Type and Number:
WIPO Patent Application WO/2023/068088
Kind Code:
A1
Abstract:
The present invention provides a base material for semiconductor wafer processing, the base material being capable of enhancing adhesion to a stage in a semiconductor wafer processing step. The present invention provides a base material which is used for an adhesive sheet for processing a semiconductor wafer having a projected part, wherein the thermal shrinkages of the base material in the machine direction (MD) and in the transverse direction (TD) after heating at 130°C for 10 minutes are both 0% or more.

Inventors:
HASUMI MIZUKI (JP)
MOTOIKE SHINGO (JP)
IIZUKA KAZUKI (JP)
NAKAMURA MASASHI (JP)
Application Number:
PCT/JP2022/037680
Publication Date:
April 27, 2023
Filing Date:
October 07, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L21/304; B32B27/00; C09J7/20; C09J7/29; C09J7/38; C09J201/00; H01L21/301; H01L21/683
Domestic Patent References:
WO2013084952A12013-06-13
WO2018181240A12018-10-04
WO2020071159A12020-04-09
WO2019208378A12019-10-31
Foreign References:
JP2003138228A2003-05-14
JP2011054940A2011-03-17
JP2011018669A2011-01-27
JP2000216123A2000-08-04
JP2013023665A2013-02-04
JP2013120841A2013-06-17
JP2020155688A2020-09-24
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
Download PDF: