Title:
PHENOLIC RESIN, EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/068089
Kind Code:
A1
Abstract:
An epoxy resin represented by formula (1) (In formula (1), each R independently represents a hydrogen atom or an alkyl group having 1-5 carbon atoms; p represents an integer of 0-4; q represents an integer of 0-3; and m and n respectively represent the number of repetitions, with the average value mave of m satisfying 0≤mave<20 and the average value nave of n satisfying 1
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Inventors:
TOHJIMA TAKAYUKI (JP)
Application Number:
PCT/JP2022/037686
Publication Date:
April 27, 2023
Filing Date:
October 07, 2022
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G59/08; C08G14/04; C08G59/62
Foreign References:
| JP2004307687A | 2004-11-04 | |||
| JP2010159362A | 2010-07-22 | |||
| JPH06172499A | 1994-06-21 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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