Title:
BASE POLYMER FOR HOT-MELT ADHESIVE AGENT, AND HOT-MELT ADHESIVE AGENT
Document Type and Number:
WIPO Patent Application WO/2014/192767
Kind Code:
A1
Abstract:
Provided is a hot-melt adhesive agent which satisfies both a solidification rate and an adhesion property.
A base polymer for a hot-melt adhesive agent, which satisfies the following requirements (1) and (2): (1) the tensile elastic modulus is 400 MPa or less at 23˚C; and (2) the crystallization half time is 20 minutes or shorter at 23˚C.
Inventors:
HASHIMA KAZUHIRO (JP)
TAKEBE TOMOAKI (JP)
MINAMI YUTAKA (JP)
INOUE MASAO (JP)
KOBAYASHI KENJI (JP)
TAKEBE TOMOAKI (JP)
MINAMI YUTAKA (JP)
INOUE MASAO (JP)
KOBAYASHI KENJI (JP)
Application Number:
PCT/JP2014/064019
Publication Date:
December 04, 2014
Filing Date:
May 27, 2014
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C09J201/00; C08F110/06; C08L23/12; C09J5/06; C09J123/12
Domestic Patent References:
| WO2003091289A1 | 2003-11-06 | |||
| WO2003087172A1 | 2003-10-23 | |||
| WO2003091289A1 | 2003-11-06 | |||
| WO2002016450A1 | 2002-02-28 |
Foreign References:
| JP2010001367A | 2010-01-07 | |||
| JP2006503966A | 2006-02-02 | |||
| JPS5819309A | 1983-02-04 | |||
| JPS61130314A | 1986-06-18 | |||
| JPH03163088A | 1991-07-15 | |||
| JPH04300887A | 1992-10-23 | |||
| JPH04211694A | 1992-08-03 | |||
| JPH01502036A | 1989-07-13 | |||
| JPH0453993B2 | 1992-08-28 | |||
| JP2000256411A | 2000-09-19 |
Other References:
A. ZAMBELLI, MACROMOLECULES, vol. 6, 1973, pages 925
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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