Title:
BASE POLYMER FOR HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2016/104539
Kind Code:
A1
Abstract:
[1] A base polymer for a hot melt adhesive containing a propylene polymer (A) having a tensile modulus of elasticity of 60 MPa or higher and an olefin polymer (B) having a tensile modulus of elasticity of less than 60 MPa in which, relative to 100 parts by mass of the total propylene polymer (A) and olefin polymer (B) content, the propylene polymer (A) content is at least 1 part by mass to less than 50 parts by mass and the olefin polymer (B) content is more than 50 parts by mass to no more than 99 parts by mass; and [2] a hot melt adhesive containing this base polymer, and at least one among (C) a tackifying resin, and (D) an oil.
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Inventors:
SAMEJIMA KANAKO (JP)
NAKASHIMA HARUMI (JP)
MINAMI YUTAKA (JP)
TAKEBE TOMOAKI (JP)
NAKASHIMA HARUMI (JP)
MINAMI YUTAKA (JP)
TAKEBE TOMOAKI (JP)
Application Number:
PCT/JP2015/085890
Publication Date:
June 30, 2016
Filing Date:
December 22, 2015
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
C09J123/00; A61F13/15; A61F13/472; C09J11/00; C09J123/04; C09J123/06; C09J123/10; C09J123/12; C09J123/20
Domestic Patent References:
WO2010032600A1 | 2010-03-25 | |||
WO2014192767A1 | 2014-12-04 | |||
WO2014077258A1 | 2014-05-22 | |||
WO2014129301A1 | 2014-08-28 |
Foreign References:
JP2013064056A | 2013-04-11 | |||
JP2013064055A | 2013-04-11 | |||
JP2011524919A | 2011-09-08 | |||
JP2010506983A | 2010-03-04 |
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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