Title:
RESIN COMPOSITION FOR EXPANDABLE LAMINATE, EXPANDABLE LAMINATE, METHOD FOR MANUFACTURING SAME, AND EXPANDED CONVERTED PAPER AND HEAT-INSULATING CONTAINER USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/104540
Kind Code:
A1
Abstract:
The present invention provides: a polyethylene resin composition for an expandable laminate, with which expanded cells (an expanded layer) having sufficient height and good appearance are obtained even under high extrusion lamination molding speeds; an expandable laminate; a method for manufacturing the same; expanded converted paper; and a heat insulating container. The present invention is a polyethylene resin composition for an expandable laminate, the composition being used in order to form a polyethylene resin layer (I) for expansion on at least one surface of a base material made mainly of paper, wherein the polyethylene resin composition for an expandable laminate is characterized by containing a polyethylene resin (A) and satisfying the following characteristics (a-1) to (a-4). (a-1) The melt flow rate (MFR) of the polyethylene resin (A), measured in accordance with JIS K7210 (190°C, load of 21.18 N), is 7 g/10 minutes to less than 20 g/10 minutes. (a-2) The density of the polyethylene resin (A) in accordance with JIS K7112 at a testing temperature of 23°C is 0.900-0.930 g/cm3. (a-3) The oxidation induction time (OIT) at 180°C is 10 minutes to less than 190 minutes. (a-4) The memory effect (ME) of the polyethylene resin (A), measured using the melt indexer used in JIS K7210, under conditions of a cylinder temperature of 240°C and a constant-speed extrusion rate of 3 g/minute, is less than 2.0.
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Inventors:
SASAKI KEIICHI (JP)
SAKAMOTO SHINJI (JP)
SAKAMOTO SHINJI (JP)
Application Number:
PCT/JP2015/085893
Publication Date:
June 30, 2016
Filing Date:
December 22, 2015
Export Citation:
Assignee:
JAPAN POLYETHYLENE CORP (JP)
International Classes:
B32B27/10; B65D65/40; B65D81/38; C08J9/12; C08L23/08
Foreign References:
| JP2014201604A | 2014-10-27 | |||
| JP2010285586A | 2010-12-24 | |||
| JP2010144134A | 2010-07-01 | |||
| JPH11302466A | 1999-11-02 | |||
| JP2013078928A | 2013-05-02 | |||
| JP2014124796A | 2014-07-07 | |||
| JP2014124797A | 2014-07-07 |
Other References:
See also references of EP 3238936A4
Attorney, Agent or Firm:
Eikoh Patent Firm, P. C. et al. (JP)
Patent business corporation glory patent firm (JP)
Patent business corporation glory patent firm (JP)
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