Title:
BLANK COLLECTING DEVICE FOR WIRE CUTTING MACHINE, AND USAGE METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/032803
Kind Code:
A1
Abstract:
A blank collecting device for a wire cutting machine. The blank collecting device comprises a workpiece (2) and a material taking plate (1) for collecting blank (5), wherein the material taking plate (1) is provided with a suction surface, and the suction surface is provided with a first suction structure and a second suction structure which can generate suction forces; the workpiece (2) is provided with a sucked surface for the suction surface to suck, and the sucked surface is divided into a processing inner peripheral area (21) and a processing outer peripheral area (22) according to a processing path of a processing apparatus, the processing path being a closed loop, the processing inner peripheral area (21) being the portion of the sucked surface inside the processing path, and the processing outer peripheral area (22) being the portion of the sucked surface outside the processing path; the processing path is divided into a front processing section and a rear processing section, and the processing apparatus sequentially performs processing along the front processing section and the rear processing section. When a wire cutting operation is performed, the blank can be accurately sucked after the blank is cut, thereby achieving the effect of collecting the blank. Further provided is a method for using a blank collecting device for a wire cutting machine.
Inventors:
PAN XUHUA (CN)
Application Number:
PCT/CN2023/112787
Publication Date:
February 15, 2024
Filing Date:
August 12, 2023
Export Citation:
Assignee:
ZHEJIANG YAWEI PREC MACHINE TOOL CO LTD (CN)
International Classes:
B23H11/00; B23H7/02
Foreign References:
| CN115229285A | 2022-10-25 | |||
| CN115351368A | 2022-11-18 | |||
| JPS6186132A | 1986-05-01 | |||
| CN109794661A | 2019-05-24 | |||
| CN111097981A | 2020-05-05 | |||
| TW202114795A | 2021-04-16 |
Attorney, Agent or Firm:
JINHUA DAQI PATENT AGENCY (SPECIAL GENERAL PARTNERSHIP) et al. (CN)
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