Title:
BOARD PIECE AND COMPOSITE WIRING BOARD USING THE BOARD PIECE
Document Type and Number:
WIPO Patent Application WO/2004/064469
Kind Code:
A1
Abstract:
A flexible wiring board constituting a board piece (2) is exposed from both edges of the board piece (2). A composite wiring board (71) is constituted by connecting a piece (102A, 102B) of different type through a flexible wiring board (8A, 8B) for connection. Constituent parts can be stored and handled separately, and therefore, the storage and handling are more convenient when compared to storage of a composite wiring board.
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Inventors:
MURAYAMA TAKASHI (JP)
Application Number:
PCT/JP2004/000026
Publication Date:
July 29, 2004
Filing Date:
January 07, 2004
Export Citation:
Assignee:
SONY CHEMICALS CORP (JP)
MURAYAMA TAKASHI (JP)
MURAYAMA TAKASHI (JP)
International Classes:
H05K1/14; H05K1/02; H05K3/00; H05K3/46; H05K3/36; (IPC1-7): H05K3/46
Foreign References:
JPH0575270A | 1993-03-26 | |||
JP2002271022A | 2002-09-20 | |||
JP2001251053A | 2001-09-14 | |||
JP2002290028A | 2002-10-04 | |||
JPH06326424A | 1994-11-25 | |||
JPH0837379A | 1996-02-06 | |||
JPH06268348A | 1994-09-22 | |||
JP2002064271A | 2002-02-28 | |||
JPH11121882A | 1999-04-30 | |||
JPH08288654A | 1996-11-01 | |||
JPH05243741A | 1993-09-21 | |||
EP0632683A2 | 1995-01-04 |
Attorney, Agent or Firm:
Ishijima, Shigeo (2-18 Toranomon 1-chome, Minato-k, Tokyo 01, JP)
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