Title:
BONDED BODY AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/202970
Kind Code:
A1
Abstract:
A bonded body according to the present invention is obtained by bonding a semiconductor element to a bonding layer that contains Cu. The bonding layer has an extension part that laterally extends from the peripheral edges of the semiconductor element. In a cross-sectional view in the thickness direction, the extension part has a lateral wall surface that rises from or near the peripheral edges of the bottom of the semiconductor element and that is substantially separated from the lateral surfaces of the semiconductor element. The extension part preferably does not have a site where the lateral wall surface comes in contact with the lateral surfaces of the semiconductor element. The present invention also provides a method for manufacturing the bonded body.
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Inventors:
ANAI KEI (JP)
YAMAUCHI SHINICHI (JP)
JO JUNG-LAE (JP)
SAKAUE TAKAHIKO (JP)
YAMAUCHI SHINICHI (JP)
JO JUNG-LAE (JP)
SAKAUE TAKAHIKO (JP)
Application Number:
PCT/JP2020/008653
Publication Date:
October 08, 2020
Filing Date:
March 02, 2020
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H01L21/52; B22F1/00; B22F3/10
Domestic Patent References:
| WO2020032161A1 | 2020-02-13 |
Foreign References:
| JP2018129352A | 2018-08-16 | |||
| JP2018111872A | 2018-07-19 | |||
| JP2013196936A | 2013-09-30 | |||
| JPS5361973A | 1978-06-02 | |||
| JP2017071826A | 2017-04-13 | |||
| JP2019216183A | 2019-12-19 | |||
| JP2014120639A | 2014-06-30 |
Other References:
See also references of EP 3951840A4
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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