Title:
BONDING MATERIAL AND BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/202971
Kind Code:
A1
Abstract:
The bonding material according to the present invention has a copper foil and a sinterable bonding film formed on one surface thereof. The bonding film comprises copper powder and a solid reducing agent. This bonding material is used for bonding with respect to a bonding object that has on the surface thereof at least one type of metal selected from among gold, silver, copper, nickel, and aluminum. The bonding material according to the present invention is also used as a material for wire bonding. The present invention further provides a bonded structure wherein a copper foil and a bonding object having formed on the surface thereof at least one type of metal selected from among gold, silver, copper, nickel and aluminum, are electrically bonded together via a bonding layer comprising a sintered structure of copper powder.
Inventors:
ANAI KEI (JP)
JO JUNG-LAE (JP)
JO JUNG-LAE (JP)
Application Number:
PCT/JP2020/008654
Publication Date:
October 08, 2020
Filing Date:
March 02, 2020
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B22F1/052; B22F1/054; B22F1/068; B22F1/107; B22F7/08; H01L21/60; H01L23/14; H01R4/02
Domestic Patent References:
| WO2017221613A1 | 2017-12-28 | |||
| WO2015068853A1 | 2015-05-14 |
Foreign References:
| JP2015090900A | 2015-05-11 | |||
| JP2018501657A | 2018-01-18 | |||
| JP2013209720A | 2013-10-10 | |||
| US20140225247A1 | 2014-08-14 |
Other References:
See also references of EP 3950175A4
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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