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Patent Searching and Data


Title:
BONDED STRUCTURE OF ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2019/234975
Kind Code:
A1
Abstract:
Provided is an endoscope comprising: a rigid tip part 50 having a first outer diameter portion 51a and a second outer diameter portion 51b, the second outer diameter portion 51b having a first length A; a cylindrical body 60; a first inner diameter portion 61 having a second length B; a second inner diameter portion 62 having a smaller diameter than the first inner diameter portion 61; and an adhesive 70 filled between an outer periphery 51g and an inner periphery 60n. The outer diameter of the outer periphery 51g of the second outer diameter portion 51b decreases toward the base end N2. The cylindrical body 60 fits over the outer periphery 51g while being pressed against a tip end N1.

Inventors:
KAGEYAMA NAOHIRO (JP)
FUJII TAKAHARU
Application Number:
PCT/JP2019/005079
Publication Date:
December 12, 2019
Filing Date:
February 13, 2019
Export Citation:
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Assignee:
OLYMPUS CORP (JP)
International Classes:
G02B23/24; A61B1/00
Domestic Patent References:
WO2011133187A12011-10-27
WO2014088024A12014-06-12
Foreign References:
JP2001133671A2001-05-18
JP2011200397A2011-10-13
Attorney, Agent or Firm:
ITOH-SHIN PATENT OFFICE (JP)
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