Title:
POWDER LAMINATE MOLDED ARTICLE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/234974
Kind Code:
A1
Abstract:
Provided are a powder laminate molded article and a production method therefor capable of suppressing warpage deformation and surface roughness that are problems involved in powder laminate molded articles produced using a laser. This production method for a powder laminate molded article uses a laser-sintering powder molding device, the method involving molding the lowermost layer of the powder laminate molded article by melting and sintering a material powder through irradiation with a high-energy laser, and molding of an intermediate layer of the powder laminate molded article by melting and sintering a material powder through irradiation of a high-energy laser at an outer shell part and through irradiation of a low-energy laser in an inner part. The powder laminate molded article is produced by molding the uppermost lay thereof by melting and sintering a material powder through irradiation with a high-energy laser.
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Inventors:
YAMAGUCHI AKIHIRO (JP)
ARAI SATOSHI (JP)
TSUNODA SHIGEHARU (JP)
ARAI SATOSHI (JP)
TSUNODA SHIGEHARU (JP)
Application Number:
PCT/JP2019/004875
Publication Date:
December 12, 2019
Filing Date:
February 12, 2019
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
B29C64/268; B29C64/153; B33Y10/00; B33Y80/00
Domestic Patent References:
WO2007058160A1 | 2007-05-24 |
Foreign References:
JP2004142427A | 2004-05-20 | |||
JPH08504139A | 1996-05-07 | |||
JP2006513055A | 2006-04-20 | |||
JP2002115004A | 2002-04-19 | |||
JP2005171299A | 2005-06-30 | |||
JPH08260162A | 1996-10-08 |
Attorney, Agent or Firm:
SEIRYO I.P.C. (JP)
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