Title:
BONDED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/215466
Kind Code:
A1
Abstract:
A bonded substrate according to the present disclosure has a support substrate formed of silicon monocrystals and a piezoelectric substrate formed of monocrystals of lithium tantalate or lithium niobate, the support substrate and the piezoelectric substrate being bonded with an amorphous layer therebetween. The amorphous layer includes a first amorphous layer disposed on the support substrate side and a second amorphous layer disposed on the piezoelectric substrate side, and the second amorphous layer contains silicon atoms in an amount of 1/3 or more of tantalum atoms or niobium atoms, as an average value of a plurality of measured points in the layer.
Inventors:
NARAHARA YOSHIHIDE (JP)
KAJIHARA MITSUHIRO (JP)
KURITA MASANORI (JP)
SHIMIZU YOSUKE (JP)
KAJIHARA MITSUHIRO (JP)
KURITA MASANORI (JP)
SHIMIZU YOSUKE (JP)
Application Number:
PCT/JP2021/016155
Publication Date:
October 28, 2021
Filing Date:
April 21, 2021
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L21/02; H03H9/25
Domestic Patent References:
| WO2014077212A1 | 2014-05-22 | |||
| WO2019159555A1 | 2019-08-22 |
Foreign References:
| JP2019169983A | 2019-10-03 |
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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