Title:
BONDING CAVITY STRUCTURE AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/134922
Kind Code:
A1
Abstract:
Disclosed are a bonding cavity structure and a bonding method. The bonding cavity comprises an upper bearing platform, a lower bearing platform, and an airflow forming mechanism. The airflow forming mechanism comprises a plurality of open-close integrated arms. A plurality of air nozzles are provided on the integrated arm facing a wafer bonding surface. The air nozzle is switched to a gas nozzle or a vacuum suction nozzle. When each integrated arm is closed, a closed environment is formed with the bearing platform. By setting each of the air nozzles located on one side of the wafer as a gas nozzle, parallel blowing is carried out in the wafer bonding surface. By setting each of the air nozzles on the other side of the wafer as a vacuum suction nozzle, the gas blown from the gas nozzle at the corresponding position is sucked. A Bernoulli effect low pressure is generated by forming a high speed airflow between two wafers, so that the wafer is not only pushed by the back surface, but also subjected to a uniform low-pressure pull force between the bonding surfaces, which can enhance the uniformity of the force exerted in the bonding process, and moreover, the influence of particles in the environment on the bonding surfaces is reduced.
Inventors:
LI XINYU (CN)
Application Number:
PCT/CN2019/122975
Publication Date:
July 02, 2020
Filing Date:
December 04, 2019
Export Citation:
Assignee:
SHANGHAI IC R & D CENTER CO LTD (CN)
International Classes:
H01L21/18; H01L21/67
Domestic Patent References:
| WO2018101024A1 | 2018-06-07 |
Foreign References:
| CN109887860A | 2019-06-14 | |||
| CN103730318A | 2014-04-16 | |||
| CN106340485A | 2017-01-18 | |||
| JP2018026413A | 2018-02-15 |
Attorney, Agent or Firm:
SHANGHAI TIANCHEN INTELLECTUAL PROPERTY AGENCY (CN)
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