Title:
BONDING COMPOSITION AND BOARD
Document Type and Number:
WIPO Patent Application WO/2012/133219
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a bonding composition having high adhesion, from which formaldehyde is not readily released. The present invention relates to a bonding composition cured by heating/compression. The bonding composition contains a polyvalent carboxylic acid.
More Like This:
| JP5491166 | Wood composite |
Inventors:
SUGAWARA RYO
UMEMURA KENJI
UMEMURA KENJI
Application Number:
PCT/JP2012/057579
Publication Date:
October 04, 2012
Filing Date:
March 23, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
SUGAWARA RYO
UMEMURA KENJI
SUGAWARA RYO
UMEMURA KENJI
International Classes:
B27D1/04; C09J133/02; B27N3/00; C09J11/06; C09J105/00; C09J135/00
Domestic Patent References:
| WO2010001988A1 | 2010-01-07 | |||
| WO2010001988A1 | 2010-01-07 |
Foreign References:
| JPS63102905A | 1988-05-07 | |||
| JP2003055637A | 2003-02-26 | |||
| JPH10504504A | 1998-05-06 | |||
| JP3796604B2 | 2006-07-12 | |||
| JP2009503193A | 2009-01-29 | |||
| JPH1045992A | 1998-02-17 | |||
| JP2006028528A | 2006-02-02 |
Other References:
"New Woody Material Handbook", GIHODO SHUPPAN CO., LTD., pages: 361
"Advanced Technologies for Chemicals from Wood Resources", 2007, CMC PUBLISHING CO., LTD., pages: 225
See also references of EP 2692810A4
"Advanced Technologies for Chemicals from Wood Resources", 2007, CMC PUBLISHING CO., LTD., pages: 225
See also references of EP 2692810A4
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
Yoshikiyo Nishikawa (JP)
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Claims: