Title:
BONDING MATERIAL, AND BONDING METHOD AND BONDING STRUCTURE USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/134974
Kind Code:
A1
Abstract:
A bonding material which improves impact resistance while improving heat resistance and can bond together objects to be bonded, and a bonding method and bonding structure using said bonding material are provided. This bonding material (10), for bonding two objects to be bonded (14a, 14b), has a first layer (11), in which the primary component is Sn, and a second layer (12), in which the primary component is a metal having a melting point higher than that of Sn, wherein the first layer (11) and the second layer (12) are stacked and the amount of Sn in the first layer (11) is greater than the stoichiometric amount of Sn that forms an intermetallic compound (15) between the Sn and the metal.
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Inventors:
NOGUCHI MASUMI (JP)
Application Number:
PCT/JP2017/000071
Publication Date:
August 10, 2017
Filing Date:
January 05, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B23K1/00; B23K35/14; B23K1/19; B23K35/26; B23K35/30; C22C9/06; C22C13/00
Domestic Patent References:
| WO2014103955A1 | 2014-07-03 | |||
| WO2013191022A1 | 2013-12-27 | |||
| WO2012086745A1 | 2012-06-28 | |||
| WO2012108395A1 | 2012-08-16 |
Foreign References:
| JP2014007227A | 2014-01-16 | |||
| JP2004174522A | 2004-06-24 | |||
| US20130048153A1 | 2013-02-28 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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