BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM

Title:

BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM

Document Type and Number:

WIPO Patent Application WO/2011/065025

Kind Code:

A1

Abstract:

Disclosed is a bonding method which is provided with: an activation step (S2) wherein the second substrate surface of a second substrate and the first substrate surface of a first substrate are activated by irradiating the first substrate surface and the second substrate surface with particles; and a bonding step (S4) wherein the second substrate and the first substrate are bonded to each other by bringing the second substrate surface and the first substrate surface into contact with each other after the difference between the temperature of the first substrate and that of the second substrate is reduced to a prescribed value or less. In the bonding method, warpage generated in the bonded substrates thus obtained is further reduced compared with warpage generated in other bonding methods wherein a first substrate and a second substrate are bonded to each other before the difference between the temperature of the first substrate and that of the second substrate is reduced to the prescribed value or less.

Inventors:

TSUTSUMI KEIICHIRO (JP)
TSUNO TAKESHI (JP)
GOTO TAKAYUKI (JP)
KINOUCHI MASATO (JP)
SUZUKI TAKENORI (JP)
IDE KENSUKE (JP)

Application Number:

PCT/JP2010/006965

Publication Date:

June 03, 2011

Filing Date:

November 30, 2010

Export Citation:

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Assignee:

MITSUBISHI HEAVY IND LTD (JP)
TSUTSUMI KEIICHIRO (JP)
TSUNO TAKESHI (JP)
GOTO TAKAYUKI (JP)
KINOUCHI MASATO (JP)
SUZUKI TAKENORI (JP)
IDE KENSUKE (JP)

International Classes:

H01L21/02; B23K20/00; B23K20/14; B23K20/24; B23K101/40

Foreign References:

JP2007201196A	2007-08-09
JP2009534842A	2009-09-24
JP2009200075A	2009-09-03
JP2009260007A	2009-11-05
JP3970304B1	2007-09-05
JP2009177034A	2009-08-06
JP2008300400A	2008-12-11

Other References: