Title:
BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/010037
Kind Code:
A1
Abstract:
A bonding method for bonding a metal base material and a resin base material together, the method comprising: a step for applying a polymer solution containing a water-soluble polymer having a functional group to a surface of the metal base material, to form a chemical bond layer that is attached and fixed to the surface of the metal base material by a covalent bond between the water-soluble polymer and a group present on the surface of the metal base material; and a step for melting the resin base material so that resin base material is fusion-bonded to the chemical bond layer attached and fixed to the metal base material.
Inventors:
MAEDA TOMOHIRO (JP)
Application Number:
PCT/JP2023/024956
Publication Date:
January 11, 2024
Filing Date:
July 05, 2023
Export Citation:
Assignee:
KISOH CO LTD (JP)
International Classes:
B29C65/02; B32B15/08; B32B37/12
Domestic Patent References:
| WO2016158516A1 | 2016-10-06 |
Foreign References:
| JP2019123228A | 2019-07-25 | |||
| JP2001293781A | 2001-10-23 | |||
| JPS59225776A | 1984-12-18 |
Attorney, Agent or Firm:
SATO INTERNATIONAL PATENT FIRM (JP)
Download PDF: