Title:
BONDING STAGE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2015/004950
Kind Code:
A1
Abstract:
This bonding stage is provided with: a rigid block (10) wherein a plurality of protrusions (11) are provided on a surface (16) thereof, said protrusions having flat upper surfaces, respectively; a flat board (20) that is fixed on supporting surfaces (18) on the protrusions (11); a ceramic board (30) that is fixed on the flat board (20) by being sucked; a board-like heater (40) that is disposed on the rigid block (10) side of the flat board (20); and a coil spring (50), which is provided between the heater (40) and the rigid block (10), and which has the heater (40) adhered on a flat board (20) surface on the rigid block (10) side.
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Inventors:
WADA SHOJI (JP)
Application Number:
PCT/JP2014/057560
Publication Date:
January 15, 2015
Filing Date:
March 19, 2014
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60
Foreign References:
| JPH0637149A | 1994-02-10 | |||
| JP2006324581A | 2006-11-30 | |||
| JP2000260825A | 2000-09-22 |
Attorney, Agent or Firm:
YKI Patent Attorneys (JP)
Patent business corporation YKI international patent firm (JP)
Patent business corporation YKI international patent firm (JP)
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