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Title:
BORON-CONTAINING COMPOUND, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/135687
Kind Code:
A1
Abstract:
The present invention relates to the technical field of semiconductors, and disclosed thereby are a boron-containing compound and an application thereof; the structure of the compound provided by the present invention is as shown in general formula (1); further disclosed by the present invention is an application of the compound. The compound provided by the present invention contains a boron atomic structure and has strong rigidity, while the molecules have the characteristics of not easily crystallizing, not easily aggregating, and having good film-forming properties; the compound of the present invention has the characteristics of TADF, and since the capabilities of groups offering electrons are different, the HOMO energy levels of materials are different, thus the compound may be used as different functional layer materials. In addition, the compound of the present invention has high fluorescence quantum efficiency and may effectively produce radiative transitions. Therefore, after the compound of the present invention is used as an organic electroluminescent functional layer material and applied to an OLED device, the current efficiency, power efficiency and external quantum efficiency of the device are greatly improved; meanwhile, the service life of the device is greatly increased.

Inventors:
LI CHONG (CN)
CAI XIAO (CN)
TANG DANDAN (CN)
WANG FANG (CN)
Application Number:
PCT/CN2019/129071
Publication Date:
July 02, 2020
Filing Date:
December 27, 2019
Export Citation:
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Assignee:
JIANGSU SUNERA TECH CO LTD (CN)
International Classes:
C07F5/02; C09K11/06; H01L51/50; H01L51/54
Domestic Patent References:
WO2018047639A12018-03-15
WO2018203666A12018-11-08
WO2017195669A12017-11-16
Foreign References:
CN107417715A2017-12-01
CN107266484A2017-10-20
CN107793441A2018-03-13
KR20180112721A2018-10-12
KR20180120619A2018-11-06
KR20180112722A2018-10-12
JP2017126606A2017-07-20
CN106467553A2017-03-01
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