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Title:
BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME
Document Type and Number:
WIPO Patent Application WO/2023/119700
Kind Code:
A1
Abstract:
According to the present invention, a bump manufacturing method on an object comprises a step for preparing the object including an electrode pad and a resist layer that has an opening thereon. In addition, this method includes: a step for inserting a needle, which has a diameter smaller than the opening diameter of the opening, into the opening so as to contact the electrode pad; a step for filling a metal particle dispersion into the opening by causing the dispersion to propagate along the needle; and a step for sintering the metal particle dispersion filled into the opening.

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Inventors:
IKUTA KEIKO
ITOI KIYOKAZU
SAKURAI DAISUKE
Application Number:
PCT/JP2022/027255
Publication Date:
June 29, 2023
Filing Date:
July 11, 2022
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L21/60; H05K3/32
Foreign References:
JP2020017656A2020-01-30
JP2000058576A2000-02-25
JP2000058586A2000-02-25
JP2004014565A2004-01-15
JP2021034628A2021-03-01
JP2019102763A2019-06-24
JP2019140298A2019-08-22
JP2019140298A2019-08-22
US20190221456A12019-07-18
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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