Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BUMPER
Document Type and Number:
WIPO Patent Application WO/2021/054434
Kind Code:
A1
Abstract:
A bumper S has an outside part 1 including: an outside plate portion 11 mounted on the outside of a vehicle; a top face plate portion 12 extending from a top end of the outside plate portion 11 toward the inside of the vehicle and having a first hole 121; and a bottom face plate portion 13 extending from a bottom end of the outside plate portion 11 toward the inside of the vehicle and having a second hole 131 with a width smaller than the width of the first hole 121 in a vehicle front-rear direction.

More Like This:
JP2000085497STRUCTURE TO ARRANGE ELECTRICAL EQUIPMENT FOR VEHICLE
JP6237854Bumper reinforcement structure
JPS60155655[Title of the device] Bumper molding mounting structure
Inventors:
MASUJIMA YUZO (JP)
Application Number:
PCT/JP2020/035421
Publication Date:
March 25, 2021
Filing Date:
September 18, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ISUZU MOTORS LTD (JP)
International Classes:
B60R19/04
Foreign References:
JP2600246B21997-04-16
JP2694650B21997-12-24
KR20110023347A2011-03-08
JPS55131851U1980-09-18
Attorney, Agent or Firm:
HIBIYA Yukihiko et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: SOLID ELECTROLYTE AND METHOD FOR PRODUCING SAME

Next Patent: CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE