CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Title:

CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Document Type and Number:

WIPO Patent Application WO/2021/054435

Kind Code:

A1

Abstract:

Provided is a circuit board in which the strength of a component mounting section can be improved. Also provided are an electronic device and electronic module of high reliability. The circuit board comprises a base having a first face, and a conductor positioned on the first face. The conductor has a region on the surface of which a plurality of first protrusions, that all protrude in the same direction oblique to a direction normal to the first face, are positioned. The electronic device and electronic module comprise the abovementioned circuit board and an electronic component mounted on the circuit board.

Inventors:

ITOU SEIICHIROU (JP)
NISHIUCHI REIKA (JP)

Application Number:

PCT/JP2020/035422

Publication Date:

March 25, 2021

Filing Date:

September 18, 2020

Export Citation:

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Assignee:

KYOCERA CORP (JP)

International Classes:

H01L23/12; H01L21/52; H01L23/14; H05K1/09; H05K1/18

Foreign References:

JPH05315283A	1993-11-26
JPH05291560A	1993-11-05
JPH07176615A	1995-07-14
JP2001244626A	2001-09-07