Title:
BUSBAR LAMINATE, ELECTRONIC COMPONENT MOUNTING MODULE INCLUDING SAME, AND METHOD OF MANUFACTURING BUSBAR LAMINATE
Document Type and Number:
WIPO Patent Application WO/2019/235189
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a busbar-employing surface-mounting electronic component module, etc., which enables reflow soldering to be used by having uniform heights for the solder mounting surfaces of a positive busbar and a negative busbar which are laminated. The present invention provides a busbar laminate including a mutually insulated and laminated first busbar and second busbar each having a region on which an external terminal of an electronic component is to be soldered, wherein the first busbar includes an opening, the second busbar includes a projection that protrudes toward the first busbar and is a soldering region, the projection of the second busbar is disposed in a location corresponding to the opening, and the soldering region of the first busbar and the soldering region of the projection are adjusted to the same height so as to enable the external terminal of the electronic component to be soldered by reflow soldering.
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Inventors:
ICHIKURA OSAMU (JP)
YAMAYA KOJI (JP)
ABE TSUBASA (JP)
KUROSU MITSURU (JP)
TAMAI YUYA (JP)
YAMAYA KOJI (JP)
ABE TSUBASA (JP)
KUROSU MITSURU (JP)
TAMAI YUYA (JP)
Application Number:
PCT/JP2019/019816
Publication Date:
December 12, 2019
Filing Date:
May 18, 2019
Export Citation:
Assignee:
NIPPON CHEMICON (JP)
International Classes:
H01G4/228; H01G2/02; H01G2/08; H01G4/30; H01G4/38; H01G9/008; H01L23/28; H01L23/36; H05K1/02
Foreign References:
| JP2006005096A | 2006-01-05 | |||
| JPH10340630A | 1998-12-22 | |||
| JPH0626117U | 1994-04-08 | |||
| JP2009259915A | 2009-11-05 | |||
| JP2001178151A | 2001-06-29 |
Other References:
See also references of EP 3822997A4
Attorney, Agent or Firm:
HAMADA Haruo (JP)
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