Title:
CAMERA MODULE, CAMERA, AND CABLE CONNECTION METHOD FOR CAMERA MODULE
Document Type and Number:
WIPO Patent Application WO/2019/194295
Kind Code:
A1
Abstract:
A camera module (45) is provided with: an imaging element (29) which is formed in a rectangular shape and has a plurality of pads (53) provided to a back surface (51) opposite from an imaging surface; a substrate (49) where, on the same plane, a plurality of linear conductors (55) are lined up in parallel and have an insulating coating in a rectangular shape such that the side of one end (57) and the other end (61) in the direction of extension of the conductors (55) is shorter than one side of the imaging element (29), the conductors (55) at the one end (57) and the other end (61) being exposed at a plate surface front and/or back; and a low-melting-point electroconductive material (41) for connecting, to each of the pads (53), the conductors (55) of the one end (57) that are exposed due to one end surface (59) of the substrate (49) being abutted against the back surface (51).
Inventors:
KUBARA TAKASHI
KAWAUCHI YOUSUKE
HATASE YUICHI
KAWAUCHI YOUSUKE
HATASE YUICHI
Application Number:
PCT/JP2019/015032
Publication Date:
October 10, 2019
Filing Date:
April 04, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
A61B1/04; G02B23/24; G02B23/26; H01L27/146; H04N5/225
Foreign References:
JPS63272180A | 1988-11-09 | |||
JP2015066300A | 2015-04-13 | |||
JPH07230872A | 1995-08-29 | |||
JP2017532100A | 2017-11-02 | |||
JP2004159970A | 2004-06-10 | |||
JP2018074004A | 2018-05-10 |
Other References:
See also references of EP 3777643A4
Attorney, Agent or Firm:
Eikoh Patent Firm, P.C. (JP)
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