Title:
CAMERA MODULE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/065067
Kind Code:
A1
Abstract:
The present disclosure relates to a camera module and an electronic apparatus that achieve better heat dissipation. A movable member has an image sensor mounted on an upper surface side thereof, and is provided movably in a direction along an imaging surface of the image sensor. A fixed member is fixed on a back surface side of the movable member with a predetermined air gap from the movable member. One or a plurality of heat-dissipating members are provided in the air gap so as to be fixed onto one of the fixed member and the movable member and to be in contact with the other. The present disclosure may be applied to a camera module in which a sensor shift scheme is adopted.
Inventors:
SHIBAZAKI SHUNICHIRO (JP)
HOSHINO KOZO (JP)
YUZUKI SHINICHI (JP)
NAKAGAWA TETSUYA (JP)
SAITO KIYOHIRO (JP)
SHISHIDO YUTA (JP)
KOBAYASHI KAZUMI (JP)
WATANABE NOBUYUKI (JP)
HOSHINO MASAKI (JP)
HOSHINO KOZO (JP)
YUZUKI SHINICHI (JP)
NAKAGAWA TETSUYA (JP)
SAITO KIYOHIRO (JP)
SHISHIDO YUTA (JP)
KOBAYASHI KAZUMI (JP)
WATANABE NOBUYUKI (JP)
HOSHINO MASAKI (JP)
Application Number:
PCT/JP2021/033251
Publication Date:
March 31, 2022
Filing Date:
September 10, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/225; G03B5/00; H04N5/232
Domestic Patent References:
| WO2015122107A1 | 2015-08-20 |
Foreign References:
| JP2012217179A | 2012-11-08 | |||
| JP2009272789A | 2009-11-19 | |||
| JP2007162889A | 2007-06-28 | |||
| JP2009011097A | 2009-01-15 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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