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Patent Searching and Data


Title:
CAPACITOR ARRAY
Document Type and Number:
WIPO Patent Application WO/2023/238681
Kind Code:
A1
Abstract:
This capacitor array 1 comprises: a capacitor unit 20 which includes a plurality of capacitor elements 10 planarly disposed in a plane direction perpendicular to a thickness direction, and in which mutually adjacent capacitor elements 10 are separated; a sealing layer 30 which seals the capacitor unit 20; and an embedded member 40 disposed inside the sealing layer 30 together with the capacitor unit 20. The capacitor elements 10 each include a first electrode layer (for example, positive electrode plate 11), a second electrode layer (for example, negative electrode layer 12), and a dielectric layer 13, wherein the first electrode layer and the second electrode layer face each other in the thickness direction with the dielectric layer 13 therebetween. The embedded member 40 has a higher melting temperature than the sealing layer 30, and is disposed on the plane-direction outer circumferential section of the capacitor unit 20.

Inventors:
AMAMOTO TAKUYA (JP)
YOSHIKAWA MASANORI (JP)
Application Number:
PCT/JP2023/019506
Publication Date:
December 14, 2023
Filing Date:
May 25, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/38; H01G2/02; H01G4/40; H01G9/055; H05K3/46
Domestic Patent References:
WO2019239937A12019-12-19
WO2019221046A12019-11-21
Foreign References:
JP2020167361A2020-10-08
JP2008078301A2008-04-03
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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