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Patent Searching and Data


Title:
DEFORMATION DETECTING SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/238682
Kind Code:
A1
Abstract:
This deformation detecting sensor comprises a holding portion which is connected to an operating panel for accepting a push operation performed by a user, and which holds the operating panel, and a piezoelectric film which is connected to the holding portion to detect deformation of the holding portion, wherein: the holding portion includes a first part connected to a housing, a second part connected to the operating panel, and resilient beam portions connecting the first part and the second part; the piezoelectric film is connected straddling the first part and the second part; the piezoelectric film includes a first piezoelectric film and a second piezoelectric film that are stacked on one another; and the first piezoelectric film and the second piezoelectric film are polarized to the same potential with mutually different polarities when bent in a stacking direction.

Inventors:
OTERA SHOZO (JP)
Application Number:
PCT/JP2023/019516
Publication Date:
December 14, 2023
Filing Date:
May 25, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G06F3/041; G06F3/047
Domestic Patent References:
WO2015129829A12015-09-03
WO2010143528A12010-12-16
WO2021177268A12021-09-10
WO2020137266A12020-07-02
WO2020213477A12020-10-22
WO2021005922A12021-01-14
WO2021079837A12021-04-29
Foreign References:
JP2015118015A2015-06-25
JP2006107140A2006-04-20
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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