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Patent Searching and Data


Title:
CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE
Document Type and Number:
WIPO Patent Application WO/2022/001983
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a ceramic-cladded copper plate, comprising the following steps: providing a copper material; forming a copper oxide layer on the surface of the copper material; heat treating the copper material on which the copper oxide layer is formed so that oxygen atoms are diffused in the copper material; removing the copper oxide layer from the heat-treated copper material; and soldering a ceramic substrate to the copper material from which the copper oxide layer is removed to produce a ceramic-cladded copper plate.

Inventors:
ZHOU WEI (CN)
XU QIANG (CN)
XIE SISI (CN)
Application Number:
PCT/CN2021/102841
Publication Date:
January 06, 2022
Filing Date:
June 28, 2021
Export Citation:
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Assignee:
BYD CO LTD (CN)
International Classes:
H05K3/02; C04B37/02
Domestic Patent References:
WO2019105814A12019-06-06
Foreign References:
CN110843272A2020-02-28
CN110734295A2020-01-31
CN108367994A2018-08-03
CN110937912A2020-03-31
Other References:
See also references of EP 4175425A4
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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