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Title:
CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, POWER MODULE, AND METHOD FOR MANUFACTURING CERAMIC-COPPER COMPOSITE
Document Type and Number:
WIPO Patent Application WO/2020/138283
Kind Code:
A1
Abstract:
Provided is a flat ceramic-copper composite comprising: a ceramic layer; a copper layer; and a brazing material layer disposed between the ceramic layer and the copper layer, wherein specific expression (1) is satisfied in a cut surface of the copper layer cut along a plane perpendicular to the main surface of the ceramic-copper composite, where S(102)% is the area ratio occupied by copper crystals having a crystal orientation inclined at an angle of 10° or less with respect to the crystal orientation of (102) plane, S(101)% is the area ratio occupied by copper crystals having a crystal orientation inclined at an angle of 10° or less with respect to the crystal orientation of (101) plane, S(111)% is the area ratio occupied by copper crystals having a crystal orientation inclined at an angle of 10° or less with respect to the crystal orientation of (111) plane, and S(112)% is the area ratio occupied by copper crystals having a crystal orientation inclined at an angle of 10° or less with respect to the crystal orientation of (112) plane.

Inventors:
YUASA AKIMASA (JP)
NAKAMURA TAKAHIRO (JP)
NISHIMURA KOJI (JP)
Application Number:
PCT/JP2019/051108
Publication Date:
July 02, 2020
Filing Date:
December 26, 2019
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B23K1/00; C04B37/02; H01L23/12; H01L23/14; H01L23/15; H05K1/09; B22F1/05
Foreign References:
JP2016139680A2016-08-04
JP2013234383A2013-11-21
JP2017075382A2017-04-20
JP2016115821A2016-06-23
JP2017175061A2017-09-28
JP2003112980A2003-04-18
JP2005268821A2005-09-29
JP2015092552A2015-05-14
JP2016039163A2016-03-22
JPH10223809A1998-08-21
JPH10214915A1998-08-11
JP2018248175A2018-12-28
Other References:
See also references of EP 3903980A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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