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Title:
CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/163931
Kind Code:
A1
Abstract:
A ceramic electronic component (100) is a ceramic wiring board, and is provided with a ceramic insulator (1) and a terminal electrode (2) provided on the surface of the ceramic insulator (1). The ceramic insulator (1) includes a crystalline material and an amorphous material. The terminal electrode (2) includes a metal and an oxide. The crystalline material and the oxide include at least one common type of a metallic element. The concentration of metallic elements in an adjacent domain having a thickness of 5 μm and surrounding the terminal electrode (2) in the ceramic insulator (1) is higher than the concentration of metallic elements in a remote domain having a thickness of 5 μm and being located 100 μm apart from the terminal electrode (2).

Inventors:
OKA TAKAHIRO (JP)
KAN TATSUNORI (JP)
Application Number:
PCT/JP2017/009679
Publication Date:
September 28, 2017
Filing Date:
March 10, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
C04B35/16; H05K3/12; H01G4/12; H01G4/30; H01L23/13
Domestic Patent References:
WO2010092970A12010-08-19
Foreign References:
JP2007273914A2007-10-18
JP2014002992A2014-01-09
JPH1075060A1998-03-17
JP2008251782A2008-10-16
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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