Title:
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/128414
Kind Code:
A1
Abstract:
The present invention relates to a ceramic substrate unit comprising: a ceramic substrate including a ceramic basic material and a circuit pattern formed on the ceramic basic material; an electrode pattern portion included in the circuit pattern on the ceramic substrate and connected to an electrode of a semiconductor chip mounted on the ceramic substrate; and a spacer bonded to the electrode pattern portion of the ceramic substrate by means of a bonding layer, wherein the spacer is made of a metal or alloy having electrical conductivity and thermal conductivity. According to the present invention, a power semiconductor chip can be mounted on a substrate in a form similar to flip-chip bonding, and thus the bonding strength of the bonding surface between a spacer and the substrate is increased to improve the reliability thereof.
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Inventors:
LEE JIHYUNG (KR)
Application Number:
PCT/KR2022/020422
Publication Date:
July 06, 2023
Filing Date:
December 15, 2022
Export Citation:
Assignee:
AMOSENSE CO LTD (KR)
International Classes:
H01L23/498; H01L23/00
Foreign References:
| KR20210133069A | 2021-11-05 | |||
| KR20210076862A | 2021-06-24 | |||
| KR20210063734A | 2021-06-02 | |||
| US20200203252A1 | 2020-06-25 | |||
| KR20200038615A | 2020-04-14 |
Attorney, Agent or Firm:
KIM, Churchill (KR)
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