Title:
CHIP COMPONENT PICK-UP APPARATUS, AND METHOD FOR ALIGNING NEEDLE AND COLLET USING CHIP COMPONENT PICK-UP APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/126258
Kind Code:
A1
Abstract:
Provided are a chip component pick-up apparatus that is capable of highly accurately aligning a needle and a collet with each other used when picking up a chip component, and an aligning method using same. Specifically provided is a chip component pick-up apparatus provided with: a collet that sticks to and acquires a chip component from a side opposite a dicing sheet; and a pick-up stage that sticks to and holds a surface not having the chip component stuck thereon, and that pushes up a chip component located directly under the collet. The pick-up stage has: a needle that pushes up the chip component; a stage upper plate having a sticking hole that sticks to and holds the dicing sheet, and a needle opening through which the needle is passed; an XY stage that adjusts the position of the needle in the needle opening; and an elevation driving part that drives the needle and the XY stage vertically with respect to a sheet surface. Also specifically provided is an aligning method using this apparatus.
Inventors:
ONJI TAKUYA (JP)
Application Number:
PCT/JP2016/087357
Publication Date:
July 27, 2017
Filing Date:
December 15, 2016
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H01L21/301; H01L21/67; H01L21/68
Foreign References:
| JP2009044044A | 2009-02-26 | |||
| JP2004228513A | 2004-08-12 | |||
| JPH0529439A | 1993-02-05 | |||
| JPH06163611A | 1994-06-10 |
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