Title:
CHIP COMPRISING VERTICAL TRANSISTORS AND PREPARATION METHOD THEREFOR, AND TERMINAL
Document Type and Number:
WIPO Patent Application WO/2023/000222
Kind Code:
A1
Abstract:
The embodiments of the present application relate to the technical field of semiconductors, and provide a chip comprising vertical transistors and a preparation method therefor, and a terminal. The chip comprises a plurality of vertical transistors, semiconductor channels of each of the plurality of vertical transistors comprise a first semiconductor channel and a second semiconductor channel, and the second semiconductor channel is arranged in a first groove. Moreover, the first semiconductor channel is in direct contact with both first and second poles of each vertical transistor, and the second semiconductor is in direct contact with the second poles. By means of the present application, the electrical performance of the vertical transistors can be adjusted by utilizing the first semiconductor channel and the second semiconductor channel.
Inventors:
LIU MINGSHAN (CN)
HOU ZHAOZHAO (CN)
DONG YAOQI (CN)
XU JEFFERY JUNHAO (CN)
HOU ZHAOZHAO (CN)
DONG YAOQI (CN)
XU JEFFERY JUNHAO (CN)
Application Number:
PCT/CN2021/107687
Publication Date:
January 26, 2023
Filing Date:
July 21, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L29/78
Foreign References:
| CN111183521A | 2020-05-19 | |||
| CN107887445A | 2018-04-06 | |||
| CN108074982A | 2018-05-25 | |||
| US20180308947A1 | 2018-10-25 | |||
| CN106158935A | 2016-11-23 | |||
| US20210013210A1 | 2021-01-14 |
Attorney, Agent or Firm:
BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)
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