Title:
CHIP DEVICE AND WIRELESS COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/147101
Kind Code:
A1
Abstract:
The present application provides a chip device, comprising a bare die, a first bonding pin, a second bonding pin, and a first welding pin. The first bonding pin and the second bonding pin are provided on the upper surface of the bare die; a first power module and a second power module are provided in the bare die, the first power module is coupled to the first bonding pin, and the second power module is coupled to the second bonding pin; and the first welding pin is separately coupled to an external power supply, the first bonding pin and the second bonding pin of the chip device. According to the technical solution, the degree of isolation between different power modules is improved, noise propagated on a power supply path can be filtered, and the power noise performance of the chip device is improved.
Inventors:
CHI YUSONG (CN)
Application Number:
PCT/CN2020/074025
Publication Date:
July 29, 2021
Filing Date:
January 23, 2020
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L25/16
Foreign References:
| CN102184917A | 2011-09-14 | |||
| CN108321129A | 2018-07-24 | |||
| CN202616226U | 2012-12-19 | |||
| CN110391689A | 2019-10-29 | |||
| CN104900620A | 2015-09-09 | |||
| CN104851863A | 2015-08-19 | |||
| CN102832189A | 2012-12-19 | |||
| US20060043425A1 | 2006-03-02 |
Other References:
See also references of EP 4084069A4
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