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Title:
CHIP EMBEDDED DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/133319
Kind Code:
A1
Abstract:
A chip embedded device (501) comprises: a supporting component (502) used to carry a chip (506) and serving as a heat dissipation component to dissipate heat generated by the chip; and a control component (503) used to control operation of the chip. A hole is arranged at the control component. The chip is embedded in the hole and in contact connection with the supporting component serving as a heat dissipation component, such that the device has a compact size and high heat dissipation performance. The chip embedded device has a compact size, high heat dissipation performance and low power consumption, and can be integrated into a microcomputing device.

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Inventors:
LI FUMAO (CN)
HUANG JIEFAN (CN)
HUANG YUANHAO (CN)
XIAO ZHENZHONG (CN)
LIU LONG (CN)
Application Number:
PCT/CN2017/089029
Publication Date:
July 26, 2018
Filing Date:
June 19, 2017
Export Citation:
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Assignee:
SHENZHEN ORBBEC CO LTD (CN)
International Classes:
H01L23/367; H01L23/13
Foreign References:
CN101770995A2010-07-07
CN102082220A2011-06-01
CN206412341U2017-08-15
CN104969426A2015-10-07
US20020124955A12002-09-12
Attorney, Agent or Firm:
CHINA TRUER IP (CN)
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