Title:
CHIP ENCAPSULATION STRUCTURE, ATOMIZER, AND ELECTRONIC ATOMIZATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/202219
Kind Code:
A1
Abstract:
Provided in the present application are a chip encapsulation structure, an atomizer, and an electronic atomization apparatus. The chip encapsulation structure comprises an encapsulation body, a chip and a first conductive layer, wherein the chip is located in the encapsulation body; the first conductive layer is located in the encapsulation body and is located on one side of the chip; and the first conductive layer is electrically connected to the chip to serve as an electrode plate of an expansion capacitor, which is electrically connected to the chip, and the expansion capacitor is used for expanding the capacitance of a built-in capacitor of the chip. Therefore, an interference signal is effectively resisted against, and the operating stability of a chip is improved.
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Inventors:
ZHAO BOSONG (CN)
DONG WENJIE (CN)
FANG WEIMING (CN)
ZHOU RUILONG (CN)
DONG WENJIE (CN)
FANG WEIMING (CN)
ZHOU RUILONG (CN)
Application Number:
PCT/CN2023/078228
Publication Date:
October 26, 2023
Filing Date:
February 24, 2023
Export Citation:
Assignee:
HAINAN MOORE BROTHERS TECH CO LTD (CN)
International Classes:
H01L23/64; B05B15/00
Foreign References:
| CN114864557A | 2022-08-05 | |||
| US7166905B1 | 2007-01-23 | |||
| US20020003294A1 | 2002-01-10 | |||
| JP2013197517A | 2013-09-30 | |||
| CN105448878A | 2016-03-30 | |||
| CN112244357A | 2021-01-22 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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