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Title:
CHIP ENCAPSULATION STRUCTURE AND METHOD, AND CHIP MODULE
Document Type and Number:
WIPO Patent Application WO/2021/237714
Kind Code:
A1
Abstract:
The present application relates to the field of encapsulation, and in particular to a chip encapsulation structure and method, and a chip module. The upper surface of the chip encapsulation structure comprises an insulating layer and several welding spots exposed from the insulating layer, which are characterized in that on the insulating layer, through holes are provided on the periphery of the several welding spots, and the through holes form grooves on the cross section of the chip encapsulation structure. By means of the present application, through holes are provided on the periphery of a chip, thereby improving the problem of chip failure caused by temperature changes.

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Inventors:
YUAN YANWEN (CN)
LENG HANJIAN (CN)
Application Number:
PCT/CN2020/093464
Publication Date:
December 02, 2021
Filing Date:
May 29, 2020
Export Citation:
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Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
H01L21/56; H01L23/31; H01L21/60; H01L23/485; H01L23/488
Foreign References:
CN1906746A2007-01-31
CN101266962A2008-09-17
CN107564878A2018-01-09
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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